| 图片 | 型号 | 品牌 | 封装 | 数量 | 描述 | PDF资料 |
|---|---|---|---|---|---|---|
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4DB0226KA3AVG | Renesas Electronics America Inc | 53-FCCSP（7.5x3） | IC DDR4 DATA BUFFER 53FCCCSP | ||
| 参数：Renesas Electronics America Inc|托盘|-|停产|动态 RAM（DRAM）|-|-|表面贴装型|53-TFBGA，FCCSP|53... | ||||||
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4DB0226KA3AVG8 | Renesas Electronics America Inc | 53-FCCSP（7.5x3） | IC DDR4 DATA BUFFER 53FCCCSP | ||
| 参数：Renesas Electronics America Inc|卷带（TR）|-|停产|动态 RAM（DRAM）|-|-|表面贴装型|53-TFBGA，FCCS... | ||||||
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4RCD0232KC0ATG | Renesas Electronics America Inc | 253-FCCSP（8x13.5） | FCCSP 13.50X8.00X1.40 MM, 0.65MM | ||
| 参数：Renesas Electronics America Inc|托盘|-|在售|动态 RAM（DRAM）|1.2V|-|表面贴装型|253-LFBGA，FCCS... | ||||||
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4RCD0232KC0ATG8 | Renesas Electronics America Inc | 253-FCCSP（8x13.5） | FCCSP 13.50X8.00X1.40 MM, 0.65MM | ||
| 参数：Renesas Electronics America Inc|卷带（TR）|-|在售|动态 RAM（DRAM）|1.2V|-|表面贴装型|253-LFBGA，... | ||||||
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4DB0226EMKB0AVG | Renesas Electronics America Inc | - | IC DATA BUFFER FOR DDR4 FCCSP | ||
| 参数：Renesas Electronics America Inc|托盘|-|最后售卖|-|-|-|-|-|-|... | ||||||
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4DB0226EMKB0AVG8 | Renesas Electronics America Inc | - | IC DATA BUFFER FOR DDR4 FCCSP | ||
| 参数：Renesas Electronics America Inc|卷带（TR）|-|最后售卖|-|-|-|-|-|-|... | ||||||
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BQ2201PNG4 | Texas Instruments | 8-PDIP | IC SRAM NONVOLATILE CNTRLR 8DIP | ||
| 参数：Texas Instruments|管件|-|停产|非易失性 SRAM|4.5V ~ 5.5V|0°C ~ 70°C|通孔|8-DIP（0.300"，7.62m... | ||||||
