| 图片 | 型号 | 品牌 | 封装 | 数量 | 描述 | PDF资料 |
|---|---|---|---|---|---|---|
|
BCM68580XFB1IFSBG | Broadcom Limited | - | 10G XPON HGU WITH 2XHSGMII | ||
| 参数：Broadcom Limited|托盘|*|在售|-|-|-|-|-|-|-|-|-|-|... | ||||||
|
|
82V3389BEQG | Renesas Electronics America Inc | 100-TQFP（14x14） | TQFP 14.00X14.00X1.40 MM, 0.50MM | ||
| 参数：Renesas Electronics America Inc|托盘|-|在售|以太网|JTAG，WAN|1|3.135V ~ 3.465V|305mA|1.1... | ||||||
|
|
BCM63159B1KFSBG | Broadcom Limited | - | 10G ENET GW | ||
| 参数：Broadcom Limited|托盘|*|在售|-|-|-|-|-|-|-|-|-|-|... | ||||||
|
|
ZL50016GAG2 | Microchip Technology | BGA-256 | 2400 | IC TELECOM INTERFACE 256BGA | |
| 参数：Microchip Technology|托盘|-|在售|开关|-|1|1.71V ~ 1.89V|115mA|-|-45°C ~ 85°C|表面贴装型|256... | ||||||
|
|
ZL50020GAG2 | Microchip Technology | BGA-256 | 2310 | IC TELECOM INTERFACE 256BGA | |
| 参数：Microchip Technology|托盘|-|在售|开关|-|1|1.71V ~ 1.89V|120mA|-|-40°C ~ 85°C|表面贴装型|256... | ||||||
|
|
ZL50020QCG1 | Microchip Technology | LQFP-256 | 2580 | IC TELECOM INTERFACE 256LQFP | |
| 参数：Microchip Technology|托盘|-|在售|开关|-|1|1.71V ~ 1.89V|120mA|-|-40°C ~ 85°C|表面贴装型|256... | ||||||
|
|
BCM63153B1KFSBG | Broadcom Limited | - | 212, BONDED 106, V/ADSL, 10G GW | ||
| 参数：Broadcom Limited|托盘|*|在售|-|-|-|-|-|-|-|-|-|-|... | ||||||
|
|
BCM65936A0IFSBG | Broadcom Limited | - | 16 CHANNEL VDSL2 PROFILE 35B AFE | ||
| 参数：Broadcom Limited|托盘|*|在售|-|-|-|-|-|-|-|-|-|-|... | ||||||
|
VSC7421XJG-02 | Microchip Technology | HSBGA-672 | 1500 | IC TELECOM INTERFACE 672HSBGA | |
| 参数：Microchip Technology|托盘|-|在售|以太网开关|串行|1|1V|-|-|0°C ~ 125°C|表面贴装型|672-BGA|672-HSB... | ||||||
|
|
VSC7428XJG-12 | Microchip Technology | HSBGA-672 | 1500 | IC TELECOM INTERFACE 11PORT | |
| 参数：Microchip Technology|托盘|-|在售|以太网开关|串行|11|-|-|-|-40°C ~ 125°C|表面贴装型|672-BGA|672-H... | ||||||
|
|
BCM68580XB1IFSBG | Broadcom Limited | - | 10G XPON HGW | ||
| 参数：Broadcom Limited|托盘|-|在售|EPON OLT|-|-|-|-|-|-|-|-|-|... | ||||||
|
VSC8256YMR-01 | Microchip Technology | HFCBGA-256 | 1500 | IC TELECOM INTERFACE 256FCBGA | |
| 参数：Microchip Technology|托盘|-|在售|以太网|SPI|4|1V，1.2V|-|-|-|表面贴装型|256-BBGA，FCBGA|256-FC... | ||||||
|
VSC8582XKS-14 | Microchip Technology | PBGA-256 | 1500 | IC TELECOM INTERFACE 256BGA | |
| 参数：Microchip Technology|托盘|-|在售|以太网|GMII，SerDes，SPI，TBI|1|1V|-|-|-40°C ~ 125°C|表面贴装... | ||||||
|
|
ZL50015GAG2 | Microchip Technology | BGA-256 | 1590 | IC TELECOM INTERFACE 256BGA | |
| 参数：Microchip Technology|托盘|-|在售|开关|-|1|1.71V ~ 1.89V|150mA|-|-40°C ~ 85°C|表面贴装型|256... | ||||||
|
82V2084PFG8 | Renesas Electronics America Inc | 128-TQFP（14x20） | IC TELECOM INTERFACE 128TQFP | ||
| 参数：Renesas Electronics America Inc|卷带（TR）|-|在售|线路接口单元（LIU）|LIU|-|3.13V ~ 3.47V|-|-|... | ||||||
|
|
82V2084PFG | Renesas Electronics America Inc | 128-TQFP（14x20） | IC TELECOM INTERFACE 128TQFP | ||
| 参数：Renesas Electronics America Inc|托盘|-|在售|线路接口单元（LIU）|LIU|-|3.13V ~ 3.47V|-|-|-40°... | ||||||
|
|
VSC8564XKS-11 | Microchip Technology | PBGA-256 | 1590 | IC TELECOM INTERFACE 256BGA | |
| 参数：Microchip Technology|托盘|-|在售|-|-|-|-|-|-|-|表面贴装型|256-BGA|256-PBGA（17x17）|... | ||||||
|
|
PM4329-FEI | Microchip Technology | BBGA-276 | 2220 | IC TELECOM INTERFACE | |
| 参数：Microchip Technology|托盘|-|在售|收发器|E1，J1，T1|-|-|-|-|-|-|-|-|... | ||||||
|
|
82P5088BBG8 | Renesas Electronics America Inc | 256-PBGA（17x17） | IC TELECOM INTERFACE 256BGA | ||
| 参数：Renesas Electronics America Inc|卷带（TR）|-|在售|线路接口单元（LIU）|E1，J1，T1|8|1.8V，3.3V|-|2... | ||||||
|
|
82P5088BBG | Renesas Electronics America Inc | 256-PBGA（17x17） | IC TELECOM INTERFACE 256BGA | ||
| 参数：Renesas Electronics America Inc|托盘|-|在售|线路接口单元（LIU）|E1，J1，T1|8|1.8V，3.3V|-|2.57 ... | ||||||
31/82 首页 上页 [26] [27] [28] [29] [30] [31] [32] [33] [34] [35] [36] 下页 尾页
