图片 | 型号 | 品牌 | 封装 | 数量 | 描述 | PDF资料 |
---|---|---|---|---|---|---|
BQ2204ASN-NTRG4 | Texas Instruments | 16-SOIC | 存储器控制器 SRAM Non-Volatile Cntrlr Unit | |||
参数:制造商:Texas Instruments,产品种类:存储器控制器,RoHS:是,包装形式:Reel,工厂包装数量:1,... | ||||||
BQ2204ASNTR | Texas Instruments | 16-SOIC | 存储器控制器 SRAM Nonvolatile Controller IC | |||
参数:制造商:Texas Instruments,产品种类:存储器控制器,RoHS:是,安装风格:SMD/SMT,封装形式:SOIC-16,包装形式:Reel,工厂包... | ||||||
BQ2204ASNTRG4 | Texas Instruments | SOIC-16 | 存储器控制器 SRAM Nonvolatile Controller IC | |||
参数:制造商:Texas Instruments,产品种类:存储器控制器,RoHS:是,安装风格:SMD/SMT,封装形式:SOIC-16,包装形式:Reel,工厂包... | ||||||
BQ2205LYPW | Texas Instruments | 16-TSSOP | 808 | 存储器控制器 Battery Back-up for Dual SRAM Banks | ||
参数:制造商:Texas Instruments,产品种类:存储器控制器,RoHS:是,最大工作温度:+ 70 C,最小工作温度:- 20 C,安装风格:SMD/SM... | ||||||
BQ2205LYPWG4 | Texas Instruments | 16-TSSOP | 存储器控制器 Battery Back-up for Dual SRAM Banks | |||
参数:制造商:Texas Instruments,产品种类:存储器控制器,RoHS:是,最大工作温度:+ 70 C,最小工作温度:- 20 C,安装风格:SMD/SM... | ||||||
BQ2205LYPWR | Texas Instruments | 16-TSSOP | 69 | 存储器控制器 Battery Back-up for Dual SRAM Banks | ||
参数:制造商:Texas Instruments,产品种类:存储器控制器,RoHS:是,最大工作温度:+ 70 C,最小工作温度:- 20 C,安装风格:SMD/SM... | ||||||
BQ2205LYPWRG4 | Texas Instruments | 16-TSSOP | 存储器控制器 Battery Back-up for Dual SRAM Banks | |||
参数:制造商:Texas Instruments,产品种类:存储器控制器,RoHS:是,最大工作温度:+ 70 C,最小工作温度:- 20 C,安装风格:SMD/SM... | ||||||
BU9348K | ROHM Semiconductor | 44-QFP(10x10) | 存储器控制器 RAM CONTROLLER 44PIN | |||
参数:制造商:ROHM Semiconductor,RoHS:是,包装形式:Bulk,工厂包装数量:1000,... | ||||||
90-1211S-I00 | Maxim Integrated | 存储器控制器 Nonvolatile Controller X 8 Chip | ||||
参数:制造商:Maxim Integrated,... | ||||||
SM223TX020000-AD | Silicon Motion, Inc. | - | CF CONTROLLER, COMMERCIAL TEMP G | |||
参数:Silicon Motion, Inc.|托盘|*|在售|-|-|-|-|-|-|... | ||||||
4DB0226KB0AVG | Renesas Electronics America Inc | 53-FCCSP(7.5x3) | FCCSP 7.50X3.00X1.20 MM, 0.50MM | |||
参数:Renesas Electronics America Inc|托盘|-|在售|动态 RAM(DRAM)|1.2V|-|表面贴装型|53-TFBGA,FCCSP... | ||||||
4DB0232KC2AVG | Renesas Electronics America Inc | 253-FCCSP(8x13.5) | FCCSP 7.50X3.00X1.20 MM, 0.50MM | |||
参数:Renesas Electronics America Inc|托盘|-|在售|动态 RAM(DRAM)|1.2V|-|表面贴装型|253-LFBGA,FCCS... | ||||||
4DB0226KB0AVG8 | Renesas Electronics America Inc | - | FCCSP 7.50X3.00X1.20 MM, 0.50MM | |||
参数:Renesas Electronics America Inc|卷带(TR)|-|在售|-|-|-|-|-|-|... | ||||||
4DB0232KC2AVG8 | Renesas Electronics America Inc | - | FCCSP 7.50X3.00X1.20 MM, 0.50MM | |||
参数:Renesas Electronics America Inc|卷带(TR)|-|在售|-|-|-|-|-|-|... | ||||||
DS1314S-2+T&R/C04 | Analog Devices Inc./Maxim Integrated | 8-SOIC | 3V NONVOLATILE CONT W/LITHIUM BA | |||
参数:Analog Devices Inc./Maxim Integrated|卷带(TR)|-|在售|非易失性 RAM|3V ~ 3.6V|-40°C ~ 85°C... | ||||||
SM223GX060000-AC | Silicon Motion, Inc. | - | 4-CH CF CONTROLLER, C-TEMP | |||
参数:Silicon Motion, Inc.|托盘|*|在售|-|-|-|-|-|-|... | ||||||
4RCD0232KC1ATG | Renesas Electronics America Inc | 253-FCCSP(8x13.5) | FCCSP 13.50X8.00X1.40 MM, 0.65MM | |||
参数:Renesas Electronics America Inc|托盘|-|在售|动态 RAM(DRAM)|1.2V|-|表面贴装型|253-LFBGA,FCCS... | ||||||
4RCD0232KC1ATG8 | Renesas Electronics America Inc | 253-FCCSP(8x13.5) | FCCSP 13.50X8.00X1.40 MM, 0.65MM | |||
参数:Renesas Electronics America Inc|卷带(TR)|-|在售|动态 RAM(DRAM)|1.2V|-|表面贴装型|253-LFBGA,... | ||||||
CY7C68023-56LTXCT | Infineon Technologies | 56-QFN-EP(8x8) | IC MEMORY CONTROLLERS 56QFN | |||
参数:Infineon Technologies|卷带(TR)|EZ-USB NX2LP?|最后售卖|NAND 闪存 - USB|3V ~ 3.6V|0°C ~ 70... | ||||||
PM8607B-F3EI | Microchip Technology | 1085-FCBGA(27x27) | NVME2016 | |||
参数:Microchip Technology|托盘|-|在售|NVMe 控制器|-|-|表面贴装型|1085-BGA, FCBGA|1085-FCBGA(27x27... |
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